Ceramic substrates and thin-film integrated circuits achieving miniaturization and high precision.
●Fine circuit pattern Line/Space: 30μm/30μm ●Pattern dimension accuracy: ±10μm
We form thin-film integrated circuits on various high-intensity, high thermal conductivity ceramic substrates. ● Side patterns (0.3t or more), and AuSn solder patterns ● Simultaneous mounting of conductors, thin-film resistors, and thin-film inductors ● Circuit formation with low dielectric loss and low noise in the high-frequency range through the combination of our unique 99.9% alumina substrate and fine patterns ● Substrate materials: alumina, aluminum nitride, zirconia, quartz
